Oppo Sub Brand REALME will launch it’s new smartphone with mediatek Helio P70 in upcoming months.

• Realme confirms that it will be the first device having P70 SoC.

•Helio P70 is built on TSMC’s 12nm FinFET process

• After the launch of MediaTeK Helio P70, Oppo sub brand realme officially announced and conforms that they will be the first manufacturer having MediaTek Helio P70 SoC in a smartphone globally with the new processor integrated.

Realme has on Twitter posted that it will be the first brand to launch a Helio P70 SoC Based smartphone globally.

A few months ago realme launch realme 1 with Helio P60 which become successor for the company. After that Realme already launched it’s Realme 2, Realme 2 Pro and Realme C1 in India, now company is planning to launch new smartphone with Helio P70.

As per specifications MediaTek Helio P70 is an octa-core SoC that’s been built on TSMC’s 12nm FinFET process powered with an enhanced AI engine, the SoC have four ARM Cortex-A73 cores clocked at up to 2.1GHz, and four ARM Cortex-A53 cores clocked at up to 2.0GHz.

For better gaming and graphics the SoC also features an ARM Mali-G72 MP3 GPU that’s clocked up to 900MHz and a multi-core APU clocked at up to 525MHz for better edge-AI processing

The SoC supports up to 32-megapixel single cameras, or 24+16-megapixel dual cameras, and comes with three independent image signal processors for reduced power consumption imaging and camera support is improved from previous generation SoC

On co connectivity P70 is 4G LTE modem is capable with up to 300Mbps peak download rates, and also supports dual 4G VoLTE.

This SoC will be available to clients by November this year.